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FGA180N30D 300V PDP IGBT June 2006 FGA180N30D 300V PDP IGBT Features * High Current Capability * Low saturation voltage: VCE(sat), Typ = 1.1 V@ IC = 40A * High Input Impedance Description Employing Unified IGBT Technology, FGA180N30D provides low conduction and switching loss. FGA180N30D offers the optimum solution for PDP applications where low condution loss is essential. C G TO-3P GCE E Absolute Maximum Rating TC = 25oC unless otherwise noted Symbol VCES VGES IC ICM IF IFM PD TJ Tstg TL Notes: Description Collector-Emitter Voltage Gate-Emitter Voltage Collector Current Pulsed Collector Current (Note 1) FGA180N30D 300 30 @ TC = 25C @ TC = 25C @ TC = 100C @ TC = 25C @ TC = 100C 180 450 10 40 480 192 -55 to +150 300 300 Units V V A A A A W W C C C Diode Continuous Forward Current Diode Maximum Forward Current Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering Purposes, 1/8" from case for 5 seconds (1) Repetitive test , pulse width = 100usec , Duty = 0.5 * Ic_pulse limited by max Tj Thermal Characteristics Symbol RJC RJC RJA Parameter Thermal Resistance, Junction-to-Case for IGBT Thermal Resistance, Junction-to-Case for Diode Thermal Resistance, Junction-to-Ambient Typ. ---- Max. 0.26 1.56 40 Units C/W C/W C/W (c)2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGA180N30D Rev. A FGA180N30D 300V PDP IGBT Package Marking and Ordering Information Device Marking FGA180N30D Device FGA180N30D Package TO-3P Reel Size -- Tape Width -- Quantity 30 Electrical Characteristics of the IGBT Symbol Off Characteristics BVCES BVCES/ TJ ICES IGES Collector-Emitter Breakdown Voltage Temperature Coefficient of Breakdown Voltage Collector Cut-Off Current G-E Leakage Current TC = 25C unless otherwise noted Parameter Test Conditions Min. Typ. Max. Units VGE = 0V, IC = 250A VGE = 0V, IC = 250A VCE = VCES, VGE = 0V VGE = VGES, VCE = 0V 300 ---- -0.6 --- --100 250 V V/C A nA On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 250uA, VCE = VGE IC = 40A, VGE = 15V IC = 180A, VGE = 15V, TC = 25C IC = 180A, VGE = 15V, TC = 125C Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 30V, VGE = 0V, f = 1MHz ---3420 520 150 ---pF pF pF 2.5 ---4.0 1.1 1.9 2.0 5.0 1.4 --V V V V Switching Characteristics td(on) tr td(off) tf Eon Eoff Ets td(on) tr td(off) tf Eon Eoff Ets Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Total Gate Charge Gate-Emitter Charge Gate-Collector Charge VCE = 200V, IC = 40A, VGE = 15V VCC = 200V, IC = 40A, RG = 5, VGE = 15V, Resistive Load, TC = 125C VCC = 200V, IC = 40A, RG = 5, VGE = 15V, Resistive Load, TC = 25C -----------------30 210 100 140 0.26 0.75 1.01 30 230 110 220 0.27 1.0 1.27 185 24 88 ---300 ----------277 36 132 ns ns ns ns mJ mJ mJ ns ns ns ns mJ mJ mJ nC nC nC 2 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT Electrical Characteristics of DIODE TC = 25C unless otherwise noted Symbol VFM trr Irr Qrr Parameter Diode Forward Voltage IF = 10A Test Conditions TC = 25C TC = 125C TC = 25C TC = 125C TC = 25C TC = 125C TC = 25C TC = 125C Min. --------- Typ. 1.1 0.9 21 35 2.8 5.6 29.4 98 Max. 1.4 -------- Units V Diode Reverse Recovery Time IF = 10A dI/dt = 200A/s ns Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge A nC 3 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT Typical Performance CharacteristicsTypical Saturation VoltageCharacteristics Figure 1. Typical Output Characteristics 300 Figure 2. Typical Output Characteristics 300 T C = 125 C 250 o T C = 25 C 250 o 20V 15V 12V 10V 20V 15V 12V 10V Collector Current, IC [A] Collector Current, IC [A] 200 200 150 150 100 V G E = 8V 50 100 V GE = 8V 50 0 0 2 4 6 0 0 2 4 6 C ollector-Em itter Voltage, V C E [V] Collector-Emitter Voltage, V CE [V] Figure 3. Saturation Voltage 180 C om m on Em itter V G E = 15V 150 T C = 125 C 120 o Figure 4. Transfer Characteristics Com m on Em itter V GE = 15V Collector Current, IC [A] Collector Current, IC [A] TC = 25 C o 100 TC = 25 C o o T C = 125 C 90 10 60 30 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 1 4 6 8 10 C ollector-Em itter Voltage, V C E [V] Gate-Emitter Voltage, V G E [V] Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level 3.0 Figure 6. Saturation Voltage vs.VGE 6 Collector-Emitter Voltage, VCE [V] Collector-Emitter Voltage, VCE [V] Com m on Em itter V GE = 15V C om m on E m itter o T C = 25 C 5 2.5 180A 2.0 4 180A 90A 2 40A I C = 20A 1.5 90A 40A 3 1.0 IC = 20A 0.5 1 0.0 25 50 75 o 0 100 125 0 4 8 12 16 20 Case Temperature, T C [ C ] G a te-E m itte r V o ltag e , V G E [V ] 4 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT Typical Performance Characteristics Figure 7. Saturation Voltage vs.VGE 6 (Continued) Figure 8. Capacitance Characteristics 8000 C om m on Em itter V G E = 0V, f = 1M H z 6000 C ies T C = 25 C o Collector-Emitter Voltage, VCE [V] C om m on Em itter o T C = 125 C 5 4 Capacitance [pF] C oes 4000 3 180A 2 90A 40A 1 I C = 20A 0 0 4 8 12 16 20 C res 2000 0 0.1 1 10 30 G ate-Em itter Voltage, V G E [V] C ollector-Em itter Voltage, V CE [V] Figure 9. Gate Charge Characteristics 15 14 C om m on Em itter R L = 5 Figure 10. SOA Characteristics 600 Ic MAX (Pulsed) 100 Ic MAX (Continuous) 100s 1ms 10 DC Operation 1 50s Gate-Emitter Voltage, VGE [V] 10 8 6 4 2 0 0 50 100 150 200 250 Vcc = 200V Collector Current, Ic [A] 12 T C = 25 C o 0.1 0.01 0.1 Single Nonrepetitive o Pulse Tc = 25 C Curves must be derated linearly with increase in temperature 1 10 100 1000 G ate Charge, Q g [nC ] Collector - Emitter Voltage, V CE [V] Figure 11. Turn-On Characteristics vs. Gate Resistance 1000 2000 1000 Figure 12. Turn Off Characteristics vs. Gate Resistance Td(off) tr Switching Time [ns] 100 Switching Time [ns] tf 100 Td(on) Com m on Em itter V CC = 200V, V GE = 15V I C = 40A T C = 25 C T C = 125 C 10 0 10 20 30 40 50 o o Comm on Emitter V CC = 200V, V GE = 15V I C = 40A T C = 25 C 10 0 T C = 125 C 10 20 30 40 50 o o Gate Resistance, R G [ ] G ate Resistance, R G [ ] 5 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT Typical Performance Characteristics Figure 13. Turn-On Characteristics vs. Collector Current Com m on Em itter VCC = 200V V G E = 15V, R G = 5 T C = 25 C o (Continued) Figure 14. Turn-Off Characteristics vs. Collector Current 1000 tr 1000 Switching Time [ns] Switching Time [ns] T C = 125 C o tf 100 Td(off) Com m on Em itter V CC = 200V V G E = 15V, R G = 5 T C = 25 C T C = 125 C o o 100 Td(on) 10 0 20 40 60 80 100 120 140 160 180 10 0 20 40 60 80 100 120 140 160 180 C ollector C urrent, I C [A ] C ollector C urrent, I C [A ] Figure 15. Switching Loss vs Gate Resistance Figure 16. Switching Loss vs Collector Current E off 1 10 Switching Loss [mJ] E on Switching Loss [mJ] E off 1 C om m on E m itter V C C = 200V V G E = 15V , R G = 5 T C = 25 C T C = 125 C 0.1 o o C om m on E m itter V C C = 200V , V GE = 15V I C = 40A T C = 25 C T C = 125 C 0.1 0 10 20 30 40 50 o o E on 0 20 40 60 80 100 120 140 160 180 G ate R esistance, R G [ ] C o lle cto r C u rre n t, I C [A ] Figure 17. Turn Off SOA Characteristics 1000 Collector Current, IC [A] 100 10 1 1 Safe O perating Area o V GE = 20V, T C = 100 C 10 100 500 Collector-Emitter Voltage, V CE [V] 6 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT Typical Performance Characteristics (Continued) Figure 18. Transient Thermal Impedance of IGBT 1 Thermal Response [Zthjc] 0.1 0.5 0.2 0.1 0.01 0.05 0.02 0.01 single pulse Pdm t1 t2 Duty factor D = t1 / t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 1 10 Rectangular Pulse Duration [sec] Figure 19. Forward Characteristics Figure 20. Typical Reverse Recovery Current 5 Reverse Recovery Current , Irr [A] I F = 10A 4 T C = 25 C o 100 T J = 125 C o Forward Current , IF [A] 10 T J = 25 C o 3 2 1 1 T C = 25 C 0.1 0.0 0.5 1.0 1.5 T C = 125 C 2.0 2.5 o o 0 100 di/dt [A/s] 500 Forw ard Voltage , V F [V] Figure 21. Typical Reverse Recovery Time 36 IF = 10A Reverse Recovery Time , trr [ns] Tc = 25 C 32 o 28 24 100 di/dt [A/s] 500 7 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT TO-3PCapacitance CharacteristicsTurn-On Characteristics vs. Gate 15.60 0.20 3.80 0.20 13.60 0.20 o3.20 0.10 9.60 0.20 4.80 0.20 1.50 -0.05 +0.15 12.76 0.20 19.90 0.20 16.50 0.30 3.00 0.20 1.00 0.20 3.50 0.20 2.00 0.20 13.90 0.20 23.40 0.20 18.70 0.20 1.40 0.20 5.45TYP [5.45 0.30] 5.45TYP [5.45 0.30] 0.60 -0.05 +0.15 Dimensions in Millimeters 8 FGA180N30D Rev. A www.fairchildsemi.com FGA180N30D 300V PDP IGBT TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FAST(R) ACExTM FASTrTM ActiveArrayTM FPSTM BottomlessTM FRFETTM Build it NowTM GlobalOptoisolatorTM CoolFETTM GTOTM CROSSVOLTTM HiSeCTM DOMETM I2CTM EcoSPARKTM 2 E CMOSTM i-LoTM ImpliedDisconnectTM EnSignaTM IntelliMAXTM FACTTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UniFETTM UltraFET(R) VCXTM WireTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life support device 1. Life support devices or systems are devices or systems which, or system whose failure to perform can be reasonably expected (a) are intended for surgical implant into the body, or (b) support to cause the failure of the life support device or system, or to or sustain life, or (c) whose failure to perform when properly used affect its safety or effectiveness. in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I19 Preliminary No Identification Needed Full Production Obsolete Not In Production 9 FGA180N30D Rev. A www.fairchildsemi.com |
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